Substrate surfaces must be flat, with no cracks or depressions, free of surface dirt, such as sheetrock mud, curing compounds, sealers, wax and any other contaminants that may de-bond the concrete substrate from the underlayment. In most cases, these bond breakers can be removed using a scarifying disc attached to a low-speed buffer. The disc’s carbon-tipped blades will remove most bond breakers from the surface of the concrete, leaving it contaminant free. In situations where the epoxy is too thick or hard for this removal method, bead blasting may be necessary.